【Ultra-High Thermal Conductivity】Features exceptional 12.8 W/m·K thermal conductivity for superior heat transfer from CPU to heat sink, ensuring optimal cooling performance.
【Low Thermal Resistance】With thermal resistance less than 0.01, it minimizes heat transfer barriers for maximum cooling efficiency and stable CPU operation.
【Extreme Temperature Stability】Operates reliably across a wide temperature range from -150°C to +250°C, maintaining consistent performance under various conditions.
【Non-Conductive Safety】Non-electrically conductive formula contains no metal particles, ensuring complete safety for electronic components and preventing short circuits.
【Easy Application】Includes a dedicated spreader tool for smooth, even application on CPU, GPU, and heat sink surfaces without mess or waste.