【High-Speed Thermal Conduction】Advanced thermal compound with 12.9 W/mK thermal conductivity ensures rapid heat transfer for optimal CPU cooling performance.
【Easy Application Formula】Non-hardening paste formula remains workable and comes with a precision applicator tool for smooth, even spreading.
【Non-Conductive Safety】Metal-free formula with zero electrical conductivity ensures safe application without risk of short circuits.
【Excellent Durability】Superior longevity with stable performance across wide temperature ranges from -150°C to +250°C.
【Ultra-Low Thermal Resistance】Minimal thermal resistance of <0.01 maximizes heat transfer efficiency between CPU and cooler.