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BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X/8P/8-A11
BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X/8P/8-A11

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Product Descriptions

BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X/8P/8-A11

  • Made by high quality metal material

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

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BST-iPH-4 IC Chip BGA Reballing Stencil Solder Template for iPhone X/8P/8-A11

Item No.: 090602550A
Total:
Estimated Shipping Cost: --More Shipping Options
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Estimated Processing Time: 1 - 3 days
30 Days DOA
One-Year Warranty
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