• 【High-Precision BGA Reballing Stencils】Professional-grade stencils specifically designed for Samsung series chip reballing with precise hole placement and snug fit for accurate solder ball positioning.

• 【Premium Steel Construction】Made from high-quality Japanese stainless steel with 700℃ high-temperature resistance, ensuring durability and long service life without deformation.

• 【Ultra-Thin 0.12mm Design】Precision die-cast construction with 0.12mm thickness provides flexibility while maintaining structural integrity for professional IC repair work.

• 【Non-Stick Tin Plating Surface】Special tin plating treatment prevents solder adhesion and enables easy removal from circuit boards without leaving cold joints or bridges.

• 【Professional Reballing Solution】Engineered for IC chip repair and rework processes, delivering high yield rates and full solder joints when properly aligned.

Specifications:

• Material: Stainless Steel
• Surface Treatment: Tin Plating
• Thickness: 0.12mm
• Temperature Resistance: Up to 700℃
• Stencil Dimensions: 100mm x 80mm
• Manufacturing Process: Precision Die Casting