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Product Descriptions
AMAOE BGA Chip Rework Reballing Stencil Magnetic Positioning Tin Pad for iPhone / Android Phone Repair
- 【Magnetic Positioning】Steel mesh magnetic leveling system frees up both hands for efficient operation
- 【Versatile Application】Suitable for repairing tin pads on BGA chips in both iOS and Android smartphones
- 【Enhanced Stability】Designed to prevent movement during tin scraping, ensuring more uniform results
- 【Precision Repair】Facilitates accurate and controlled tin pad repair for delicate electronic components
- 【User-Friendly Design】Easy-to-use tool optimized for mobile device repair technicians and enthusiasts