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【Magnetic Positioning】Steel mesh magnetic leveling system frees up both hands for efficient operation
【Versatile Application】Suitable for repairing tin pads on BGA chips in both iOS and Android smartphones
【Enhanced Stability】Designed to prevent movement during tin scraping, ensuring more uniform results
【Precision Repair】Facilitates accurate and controlled tin pad repair for delicate electronic components
【User-Friendly Design】Easy-to-use tool optimized for mobile device repair technicians and enthusiasts
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AMAOE BGA Chip Rework Reballing Stencil Magnetic Positioning Tin Pad for iPhone / Android Phone Repair
Item No.:
6616001408A
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Estimated Processing Time:
1 - 3 days
30 Days DOA
One-year warranty
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