• 【Precision Laser-Etched Steel Stencil】High-precision laser etching technology ensures accurate solder paste printing positioning for reliable chip reballing operations.
• 【Specialized Design for iPhone 17 Series】Specifically engineered for iPhone 17 series Face ID module repair, supporting both small board and flex cable reballing processes.
• 【Dual Layout Configuration】Features distinct "Small Board Reballing" and "Flex Cable Reballing" opening layouts to accommodate different repair scenarios and component types.
• 【Professional Grade Thickness】0.12mm face thickness provides optimal solder paste volume control for precise BGA/QFN package chip reballing applications.
• 【High-Precision Repair Support】Dotted line contour openings ensure accurate alignment and easy demolding for professional-grade repair operations.

Specifications:

• Material: Stainless Steel
• Face Thickness: 0.12mm
• Application: BGA/QFN chip reballing