• 【High-Precision Testing】Utilizes imported beryllium copper spring probes for excellent conductivity, ensuring stable performance under load and minimal deviation in test values.
• 【Innovative Probe Design】Features conical probes that resist rosin and solder adhesion, maintaining accuracy and reducing maintenance needs.
• 【Premium Construction】Crafted from high-quality aluminum alloy with a sleek sapphire color finish, combining durability with a fashionable aesthetic.
• 【User-Friendly Design】Incorporates a convenient locking mechanism for quick and easy setup, showcasing professional-grade functionality.
• 【Precision Alignment】Dual-headed probes align precisely with small holes, enhancing contact performance and ensuring accurate test data.
• 【Secure Board Mounting】Locking clasps hold the motherboard firmly in place, preventing warping and guaranteeing more precise test results.

Specifications:

• Material: Aluminum alloy body
• Probe Material: Imported beryllium copper
• Probe Type: Spring-loaded, conical tip
• Application: Motherboard layer testing for iPhone 15 series