• 【Versatile Repair Solution】 Suitable for repairing various sizes of mobile phone components, offering quick, efficient, and stable patching
• 【Seamless Repairs】 Replaces traditional fly-wire methods, resulting in invisible repairs without trace
• 【Easy Application】 Convenient and fast to use, eliminating the need for wire looping or flying, allowing direct pad application
• 【Simple Process】 Just peel off the protective layer and immediately repair your soldering board
• 【Improved Efficiency】 After spot welding double-layer motherboards, placement or functional testing can be done without the hassle of wire flying, enhancing maintenance efficiency
• 【Enhanced Stability】 Provides greater stability to the soldering board and restores original functionality

Specifications:

• Material: Conductive adhesive
• Application: Mobile phone repair
• Usage: Soldering pad replacement
• Features: Quick application, invisible repair, direct pad addition
• Compatibility: Various mobile phone sizes