• 【Semiconductor Cooling Technology】Advanced semiconductor cooling technology rapidly reduces phone temperature and can cool devices down to 0°C within 30 minutes of operation.
• 【Magnetic Phone Mounting】Strong magnetic mounting supports MagSafe-compatible devices and provides a secure fit for compatible smartphones during gaming sessions.
• 【Smart Temperature Display】Built-in intelligent temperature control and digital LED display show the cooling plate temperature in real time for convenient monitoring.
• 【Slim Ergonomic Profile】The slim profile with smooth rounded edges fits comfortably on the phone back while helping maintain an unobstructed grip during gaming.
• 【UFO Cooling Design】The UFO design uses a 5.6 cm cooling module and supports a standard 5V/3A power input for cooling efficiency.

Specifications:

• Cooling Module Diameter: 5.6 cm
• Product Thickness: 2 cm
• Input: 5V/3A
• Recommended Input Power: 18W+ Charger
• Chip Type: Professional TEC Chip