RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGARELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGARELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGARELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGARELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA

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Product Descriptions

RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
  • These stencils were made by high-quality eco-friendly material, anti-swell, heat-resistant and scratch-resistant, can be heated directly by a hot air gun
  • Super flexible and tough with good flatness, not easy to deform, with the normal bend it can be restored easily
  • Pioneer half engraving process, allow some components to be embedded on the groove in order to block the remaining tin and protect them from being burnt
  • Precise hole position of real machine measurements, with Cooling hole design, restore every soldering ball present on the initial drawing
  • The round-square hole makes the net more durable, it is easy and quickly for reballing and taking out, prevents the tin ball from getting stuck in the mesh

Note: The soldering process is complicated, so we highly recommend a professional to replace/solder, novices need the guidance of a professional.

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RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA 1
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA 2
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA 3
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA 4
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA 5
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA 6
RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA 7

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RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA

Item No.: 661600393A
Brand: RELIFE
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Estimated Processing Time: 1 - 3 days
30 Days DOA
One-year warranty
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