• Large power and rapid heating

• Air control and temperature control

• Standard four different air gun nozzles for multiple jobs
  

• Fits most of SMD, such as SOIC, CHIP, QFP, PLCC, BAG, etc.

• Suitable to hot shrink, drying, remove lacquer and mucosity, thaw, preheating, disinfect, and so on

Specification:

• Power consumption: 580W

• Temperature range: 100℃~450℃