• High precision air and heat control for welding and removing with security and reliability

• Suitable for desoldering various kinds of components such as SOIC, CHIP, QFP, PLCC, BGA etc.

• Can be used for heat shrinkage, drying, paint and sticker removal, preheating, glue connecting etc.

Specification:

• Airflow: 24L/min(max)

• Outer dimension: 185x125x245mm

• Power: 320W 

• Temperature: 150°C~500°C