• 【Multi-Temperature Selection】Four temperature grades available (140℃, 160℃, 183℃, 199℃) to meet different electronic repair requirements, especially for mobile phone motherboard repairs.
• 【Superior Welding Performance】No cold solder joints, no-clean formula with fast wetting properties ensures excellent wettability and bright, plump solder joints.
• 【Professional Grade Quality】Specifically designed for precision electronic repairs including mobile phone motherboard BGA and QFN component soldering applications.
• 【Minimal Residue Formula】Low residue composition reduces post-soldering cleanup requirements while maintaining professional-grade performance standards.
• 【Sealed Protection Design】Black container with color-coded cap provides excellent sealing to prevent oxidation and maintain product freshness.

Specifications:

• Temperature Grades: 140℃, 160℃, 183℃, 199℃ (4 options)
• Product Weight: 50g
• Dimensions: Ø40mm x H31mm