MIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch
MIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch
MIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inchMIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch

Product Descriptions

Specifications

Reviews

Product Descriptions

MIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch

MJ 2 in 1 BGA Reballing Stencil Platform Jig Fixure is professional BGA Reballing Stencil Fixture for iPhone 11, motherboard BGA reballing fixture tool, is used for positioning and reballing PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone 11 BGA reballing and repairing.

  • Install the cell phone main board on the platform

  • Cover the cell phone BGA reballing stencil on mainboard

  • Evenly spread tin on the cover of the reballing stencil

  • Remove the reballing stencil cover

  • Take out the motherboard and cooperate with the hot air gun to solidify the tin point

Specifications

General

Package Weight

Reviews

  • Wholesale
  • Customization

MIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch

Item No.: 231401737A
Total:
Estimated Shipping Cost: --More Shipping Options
Shipping To -- via --
Estimated Processing Time: 1 - 3 days
30 Days DOA
One-year warranty
Secure Payment