MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
【Wide Compatibility】Suitable for chips up to 20 x 18.5mm, accommodating most common chip sizes for versatile application
【Adjustable Temperature】Precise heat control from 160°C to 250°C prevents chip damage from overheating or improper temperature settings
【Effortless Desoldering】Eliminates the need for soldering wire, allowing easy removal of solder and adhesive with a single wipe for quick and convenient tinning
【Pad Protection】Avoids repeated scraping with soldering irons, preserving the integrity of the pad surface during the desoldering process
【Safe and Efficient】Features a low-voltage heating plate for rapid heating without electrical leakage or static discharge, ensuring safer operation
【User-Friendly Design】Incorporates hidden screws and flexible telescopic clamping to prevent residue accumulation, enhancing durability and ease of use
Specifications:
Product Name: SL-2 CPU Chip Desoldering Platform
Compatible Chip Size: Up to 20 x 18.5mm
Temperature Range: 160°C - 250°C
Heating Method: Low-voltage heating plate
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MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool