• 【Low Melting Point】Melts at 158℃, ideal for temperature-sensitive electronic repairs, including smartphones and PCB components
• 【Strong Soldering Power】Delivers excellent adhesion with fine and even tin beads, ensuring stable and reliable joints
• 【Enhanced Conductivity】Upgraded silver-infused formula significantly improves conductivity and reduces false soldering
• 【Smooth & Uniform Texture】Fine and sticky consistency prevents tin bubbling and ensures uniform solder ball formation
• 【High Efficiency Formula】High resistance and durability with strong welding performance, designed for precision micro-soldering tasks

Specifications:

• Melting Point: 158℃
• Microns: 25 - 40um
• Storage: 0 - 10℃
• Type: Low-temperature solder paste
• Application: Electronic component soldering