• 【High-Quality Antioxidant Formula】Advanced no-clean solder paste with superior antioxidant properties ensures longer shelf life and maintains excellent performance during storage.
• 【Three Temperature Options】Available in 138°C, 158°C, and 183°C melting points to accommodate different components and applications, from low-temperature soldering to high-precision chip work.
• 【Uniform Fine Tin Beads】Features evenly distributed, fine tin beads with moderate viscosity that prevent component shifting and ensure consistent, void-free solder joints.
• 【No Residue Clean Joints】Lead-free formula with rosin flux activator creates strong, shiny solder joints with no residue, eliminating the need for post-soldering cleaning.
• 【Excellent Wettability】Superior wetting properties ensure full joint coverage and strong adhesion, preventing cold joints and providing reliable connections.
• 【Professional Grade Performance】Specifically designed for precision electronic repair and assembly, delivering consistent results for mobile repair, BGA rework, and SMT applications.

Specifications:

• Weight: 50g per container
• Applications: Mobile repair, BGA chip rework, SMT assembly, LED soldering, wire connections
• 183℃ application: CPU/ chip/hard disk/tail plug, etc.
• 158℃ application: tin plating in the middle layer of double-layer motherboard, etc.
• 138℃ application: changing tin and dragging tin, low temperature welding, etc.