BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting NetBEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting NetBEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting NetBEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting NetBEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting NetBEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting NetBEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net

Product Descriptions

Specifications

More Images

Reviews

Product Descriptions

BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net
  • 【High-Temperature Resistant】Specially designed adhesive tape capable of withstanding high temperatures, ideal for soldering and chip mounting applications.

  • 【3D Solder Mask Terminator】Effectively secures and terminates 3D solder masks, ensuring precise chip placement and soldering.

  • 【Advanced Polymer Material】Utilizes high-quality polymer material for superior durability and performance in electronic assembly processes.

  • 【Instant Positioning】Features a quick-stick design that allows for immediate and accurate positioning of chips and components.

  • 【Corrosion Resistant】Provides excellent protection against corrosion, extending the lifespan of mounted chips and electronic components.

Specifications:

  • Material: High-polymer, heat-resistant adhesive
  • Application: Chip fixation, 3D solder mask termination
  • Features: High-temperature resistance, corrosion protection
  • Positioning: Instant (one-second) adhesion
  • Base Layer: Fire-resistant high-polymer adhesive

Specifications

General

Package Weight

More Images

Download Images
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net 1
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net 2
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net 3
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net 4
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net 5
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net 6
BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net 7
Authorization Image

Reviews

  • Wholesale
  • Customization

BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net

Item No.: 6616001565A
Brand: BEST
Total:
Estimated Shipping Cost: --More Shipping Options
Shipping to -- via --
Estimated Processing Time: 1 - 3 days
30 Days DOA
One-Year Warranty
Secure Payment