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ACHI IR6500 BGA Rework Station Desoldering Machine for Phone Repair - EU Plug
- 【Dual Temperature Zone Independent Control】Features upper and lower independent heating systems with PID temperature control for precise BGA/CSP/QFN component rework without PCB warping.
- 【Professional Aluminum Alloy Rail System】High-precision X/Y axis manual micro-adjustment positioning with aluminum alloy guide rails and locking knobs for accurate component alignment.
- 【Modular Heating Head Design】Quick-change heating heads with multiple nozzle sizes and heating plates to accommodate various BGA package sizes and pitch requirements.
- 【Real-Time Temperature Monitoring】Integrated temperature sensors with dual digital displays provide accurate temperature feedback and control for optimal soldering results.
- 【Complete Safety Protection System】Emergency stop button, circuit breaker protection, and anti-dry heating design ensure safe operation during electronic repair work.
- 【Professional Lighting and Ergonomics】Flexible LED work lighting with adjustable positioning for clear visibility of solder joints and component details during repair operations.