• 【Dual-sided Efficiency】The BH17 features a practical double-sided design, allowing technicians to switch between different types of BGA chips without changing platforms. This is particularly suitable for high-efficiency batch repair environments, maximizing productivity.
• 【Magnetic Stability】Built-in strong magnets firmly secure CPU/BGA chips, preventing displacement during solder paste application and hot air reflow. This ensures perfect chip alignment and reduces solder bridges and defects.
• 【Specialized Design】Specifically designed for CPU and various BGA IC packages, offering precise stencil alignment and uniform solder ball positioning. It's an ideal choice for professional motherboard and smartphone repairs.
• 【High-precision Manufacturing】The platform is CNC machined with precision, ensuring a tight fit between the stencil and chip surface. This guarantees consistently high-quality reballing results for demanding technicians.
• 【Heat-resistant Durability】Made from materials designed to withstand high-temperature reflow soldering environments, the BH17 maintains stability even under high heat. Its durability meets the needs of professional repair labs for long-term, repeated use.

Specifications:

• Model: BH17
• Base Thickness: T0.6mm and T0.35mm (dual-thickness design)
• Stencil Quantity: 75 pieces
• Material: Black engineering plastic and metal structure for the base, stainless steel for stencils