1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm
1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm
1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm

Product Descriptions

Specifications

Reviews

Product Descriptions

1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm
  • Brand new and high quality

  • Solder tin paste is the best choice of reballing IC 

  • It is used instead of the pin in the IC component package structure

Specification:

  • Brand: BEST

  • Model: 505

  • Material: tin

  • Diameter: 0.2mm~0.65mm 

  • Flux content: 63%

  • Melting point: 183°C

  • Working temperature: 200-380°C

  • Quantity: 25,000pcs per bottle

  • Balls alloy: Sn63/Pb37

  • Size: 35x16mm

Specifications

General

Package Weight

Reviews

  • Wholesale
  • Dropshipping
  • Customization

1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm

Item No.: 231401329B
Same model in different colors:
  • 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm
  • 1 Bottle Tin BGA Reballing Solder Balls for BGA Rework Repair Tools - Diameter: 0.25mm
  • 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.3mm
  • 1 Bottle Tin BGA Reballing Solder Balls for BGA Rework Repair Tools - Diameter: 0.35mm
  • 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.5mm
  • 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Maintain Tools - Diameter: 0.55mm
  • 1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.6mm
Total:
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Estimated Processing Time: 1 - 3 days
30 Days DOA
One-year warranty
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