• 【Lead-Silver Solder Paste】 Contains lead and silver for strong conductivity and improved strength in solder joints
• 【Optimized Medium-Temperature Welding】 183℃ melting point protects temperature-sensitive components while ensuring high-quality connections
• 【Excellent Wettability】 Provides superior spreading and adhesion for reliable solder joints
• 【High Yield Performance】 Easy to print with minimal tin bridging, resulting in high production yield rates
• 【No-Clean Formula】 Eliminates the need for post-soldering cleaning, saving time and resources in the manufacturing process

Specifications:

• Melting Point: 183℃
• Quantity: 40G
• Composition: Lead and silver content
• Viscosity: Moderate
• Oxidation Resistance: Yes
• Solder Joint Appearance: Bright and full
• Paste Consistency: Fine, no collapse or deviation
• Application Range: Wide