• 【Low Melting Point】 Features a low melting point of 138℃, enabling smooth and efficient soldering processes
• 【Strong Adhesion】 Ensures durable and long-lasting bonds for reliable connections
• 【Excellent Wettability】 Provides superior wetting performance for improved solder joint quality
• 【Versatile Application】 Suitable for a wide range of electronic components and circuit boards
• 【Efficient Soldering】 Facilitates quick and effective soldering operations, enhancing productivity

Specifications:

• Melting Point: 138℃
• Microns: 25 - 40um
• Storage: 0 - 10℃
• Type: Low-temperature solder paste
• Application: Electronic component soldering