• 【High Activity and Fine Texture】Uniform and fine texture ensures excellent adhesion, bubble-free solder ball placement, and firm soldering results.
• 【Optimal Wettability】Easy to operate and solder, with a high yield rate. Effectively prevents oxidation on the soldering surface, extending the service life of solder joints for long-lasting and stable connections.
• 【Environmentally Friendly】Odorless and eco-friendly solder paste designed for chip-level soldering, compatible with mobile phones, PC boards, and other precision electronic devices.
• 【Superior Viscosity】New formula offers excellent storage stability and outstanding oxidation resistance, maintaining optimal consistency for precise applications.
• 【Versatile Temperature Options】Available in five different melting point specifications (138°C, 158°C, 183°C, 199°C, 217°C) to suit various soldering requirements.
• 【Non-Conductive Properties】Ensures circuit safety during the soldering process, making it ideal for delicate electronic components.
• 【High-Precision Application】Specially formulated for chip-level precision soldering, easily meeting high-accuracy requirements in electronic device repairs and assembly.

Specifications:

• Net Content: 30g
• Temperature Specifications: 138°C, 158°C, 183°C, 199°C, 217°C
• Composition: Lead-free and halogen-free
• Viscosity: High viscosity with optimal consistency
• Oxidation Resistance: Strong
• Conductivity: Non-conductive
• Odor: Odorless
• Storage Stability: Excellent
• Compatibility: Suitable for mobile phones, PC motherboards, and other precision electronic devices requiring high-accuracy soldering