• 【Hook-Shaped Precision Design】Curved hook tips allow precise access to tight spaces under IC chips and small components for effective adhesive removal.
• 【Hand Forged Blades】Each blade is hand forged for superior strength and durability, ensuring long-lasting performance in demanding repair tasks.
• 【High Ductility Construction】Made with high ductility metal for flexibility and resistance to breakage during intensive scraping and prying operations.
• 【Multi-Purpose Adhesive Removal】Efficiently removes underfill adhesive from phone PCB boards, screens, back covers, and frames during smartphone restoration.
• 【Handle-Compatible Design】Features a slotted center for secure attachment to compatible handles, making it ideal for professional technicians and DIY repair enthusiasts.

Specifications:

• Model: BL01
• Blade Type: Hook / Curved
• Blade Process: Hand Forged
• Material Feature: High Ductility
• Application: IC Scraping Glue, Disassemble Small Chip Components