• 【Precision Engineering】 0.6mm solder balls with smooth spherical surfaces ensure precise and reliable connections in electronic assemblies
• 【High Yield Production】 Manufactured with precise diameter control and tolerance of only 8 micrometers for consistent quality
• 【Excellent Tin Planting Effect】 Features a melting point of 183℃, suitable for a wide range of soldering needs, including BGA components
• 【Wide Range of Applications】 Ideal for computer motherboard repairs, PCB production, chip soldering, and other precision electronic work
• 【Large Capacity】 Each bottle contains 25,000 pieces, ensuring ample supply for extensive usage while maintaining compact packaging for smaller-sized particles

Specifications:

• Model: RL-043B
• Size: 0.6mm diameter
• Weight: 27.5g
• Quantity: 25,000 Pieces/Bottle
• Melting Point of Solder Balls: 180℃