• 【Multi-Function Heating】 Suitable for tinning, chip glue removal, separation preheating, and mainboard layering operations.
• 【Intelligent Temperature Control】 Offers precise temperature regulation from ambient to a maximum of 380°C.
• 【Modular Design】 Features strong compatibility and can be freely switched according to specific needs.
• 【Large Operating Area】 Supports larger motherboard desoldering operations for convenient and fast work.
• 【Versatile Application】 Ideal for various tasks including tinning, chip glue removal, separation preheating, and mainboard layering.

Specifications:

• Temperature Range: Ambient to 380℃
• Functions: Tinning, chip glue removal, separation preheating, mainboard layering
• Design: Modular with interchangeable components
• Operating Area: Large, suitable for extensive motherboard operations
• Temperature Control: Intelligent system