• 【Lead-Silver Composition】 Contains lead and silver for enhanced conductivity and strength in solder joints
• 【Medium Temperature Formula】 Optimized for 183°C soldering, protecting temperature-sensitive components
• 【Excellent Wettability】 Provides superior wetting properties for improved solder flow and coverage
• 【High Yield Performance】 Easy to print with minimal tin bridging, resulting in high production yields
• 【No-Clean Formula】 Eliminates the need for post-soldering cleaning, streamlining the production process
• 【Oxidation Resistant】 Offers resistance to oxidation, ensuring long-lasting and reliable solder joints
• 【Syringe Design】 Convenient 10CC syringe packaging for precise application and easy handling

Specifications:

• Melting Point: 183°C
• Packaging: 10CC syringe
• Solder Type: Lead-silver alloy
• Application: Medium temperature soldering
• Features: No-clean, oxidation resistant, high conductivity
• Suitable for: Temperature-sensitive components
• Performance: High yield, minimal bridging
• Finish: Bright and full solder joints