【Motherboard Protection Design】The ball-head design effectively prevents damage to the motherboard, ensuring safety during the soldering process.

【Premium Material】Made of pure copper with gold plating, offering excellent conductivity and oxidation resistance.

【Uniform Tinning】Quick and even tinning process ensures consistent soldering quality.

【High Compatibility】Suitable for various phone models, meeting the needs of different users.

【Durability】High-quality materials and design extend the product's lifespan, reducing the frequency of replacement.