Tous
Rechercher
FrançaisUSD
BienvenueSe connecter/S'inscrire
0 Articlesliste de souhaits
0 Articles$0.00
Services de gros
Centre d'assistance
Descriptions de produits
Spécifications
Plus d'images
Avis
Descriptions de produits
SUNSHINE LS4 Multi-Function Heating Platform Glue Removal Layering Machine Chip Desoldering Preheating Station - EU Plug
- 【Multi-Function Heating】 Suitable for tinning, chip glue removal, separation preheating, and mainboard layering operations.
- 【Intelligent Temperature Control】 Offers precise temperature regulation from ambient to a maximum of 380°C.
- 【Modular Design】 Features strong compatibility and can be freely switched according to specific needs.
- 【Large Operating Area】 Supports larger motherboard desoldering operations for convenient and fast work.
- 【Versatile Application】 Ideal for various tasks including tinning, chip glue removal, separation preheating, and mainboard layering.
Specifications:
- Temperature Range: Ambient to 380℃
- Functions: Tinning, chip glue removal, separation preheating, mainboard layering
- Design: Modular with interchangeable components
- Operating Area: Large, suitable for extensive motherboard operations
- Temperature Control: Intelligent system
Spécifications
Général
Poids du colis
Plus d'images
Télécharger les images