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Descriptions de produits
RELIFE HW21 Medium Temperature Solder Paste 40G / 183-Degree Melting Point for Electronics Soldering (Containing Leaded Silver)
- 【Lead-Silver Solder Paste】 Contains lead and silver for strong conductivity and improved strength in solder joints
- 【Optimized Medium-Temperature Welding】 183℃ melting point protects temperature-sensitive components while ensuring high-quality connections
- 【Excellent Wettability】 Provides superior spreading and adhesion for reliable solder joints
- 【High Yield Performance】 Easy to print with minimal tin bridging, resulting in high production yield rates
- 【No-Clean Formula】 Eliminates the need for post-soldering cleaning, saving time and resources in the manufacturing process
Specifications:
- Melting Point: 183℃
- Quantity: 40G
- Composition: Lead and silver content
- Viscosity: Moderate
- Oxidation Resistance: Yes
- Solder Joint Appearance: Bright and full
- Paste Consistency: Fine, no collapse or deviation
- Application Range: Wide
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