MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal ToolMAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal ToolMAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal ToolMAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal ToolMAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool

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MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool
  • 【Wide Compatibility】Suitable for chips up to 20 x 18.5mm, accommodating most common chip sizes for versatile application
  • 【Adjustable Temperature】Precise heat control from 160°C to 250°C prevents chip damage from overheating or improper temperature settings
  • 【Effortless Desoldering】Eliminates the need for soldering wire, allowing easy removal of solder and adhesive with a single wipe for quick and convenient tinning
  • 【Pad Protection】Avoids repeated scraping with soldering irons, preserving the integrity of the pad surface during the desoldering process
  • 【Safe and Efficient】Features a low-voltage heating plate for rapid heating without electrical leakage or static discharge, ensuring safer operation
  • 【User-Friendly Design】Incorporates hidden screws and flexible telescopic clamping to prevent residue accumulation, enhancing durability and ease of use

Specifications:

  • Product Name: SL-2 CPU Chip Desoldering Platform
  • Compatible Chip Size: Up to 20 x 18.5mm
  • Temperature Range: 160°C - 250°C
  • Heating Method: Low-voltage heating plate

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  • Al por mayor
  • Personalización

MAANT SL-2 Mobile Phone CPU IC Chip Heating Desoldering Platform Adjustable Temperature Glue Removal Tool

N° de Artículo: 6616001326A
marca: MaAnt
Total:
Costo de Envío Estimado: --Más Opciones de Envío
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Tiempo de procesamiento estimado: 1 - 3 días
30 Días DOA
Garantía de un año
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