• 【Versatile Design】 Features parallel holes, 45° angled holes, and offset holes to accommodate a wide range of IC configurations commonly used in mobile devices.
• 【Multiple Spacing Options】 Available in 0.3mm, 0.35mm, 0.4mm, and 0.5mm spacing to suit various chip requirements.
• 【Comprehensive Compatibility】 Supports most current mobile phone IC designs, ensuring broad applicability in repair and assembly processes.
• 【Easy Repair Solution】 Facilitates efficient and precise tin soldering for IC replacement and board repair tasks.
• 【Dual Pack】 Includes two pieces of multi-functional universal tin planting nets for added value and convenience.

Specifications:

• Hole Configurations: Parallel, 45° angled, Offset
• Spacing Options: 0.3mm, 0.35mm, 0.4mm, 0.5mm